Industry news_Enterprise News_Product news

Four disruptive technologies to change semiconductor engineering!

As the competition in the global electronics manufacturing industry has become more and more intense, in order to maintain the competitive advantage, many companies are continuously rolling. The development cost of semiconductor products is becoming higher and higher, and development has become more and more complicated.So, how do those subversive technologies affect the current strategies of these companies and how do they change their current engineering methods? 一、The semiconductor development competition has intensifiedFaced with problems such as labor shortage, delay in supply chain, and lack of materials, chip manufacturers are compete for new and improved semiconductor products.Small companies work hard to seek to gain a foothold in the industry, Intel, Samsung, Apple and TSMC (TSMC) leading companies such as markets are seeking competitive advantages. According to the recent report, to maintain a leading position in the industry, TSMC is still the first choice for industry analysts.However, its competitors are rapidly narrowing the gap.As Moore's Law touches the ceiling, the limitations of technology are overtaken the potential of innovation, and the business feasible choices are less and less.If any of these companies have made substantial progress in the semiconductor engineering field, they may subvert the entire global electronic manufacturing industry——This means that they either promote the industry to a new niche market, or in the process of leading companies to find a new foothold, causing unconventional explosive growth.If an enterprise wants to occupy a place in the semiconductor market, the cost is getting higher and higher.From 2019 to 2022, the manufacturing cost increased by 7%, and the import price rose by 5.7%.Some disruptive technologies may provide a method for enterprises to meet the growing demand and logistics pressure that affects its profitable. 二、Four technologies of subverting semiconductor engineeringSome new technologies will subvert the design, production and distribution of semiconductor products, which will have a significant impact on the electronic manufacturing industry. 1. Self -healing, deformable soft composite materialsA research team at the University of Carnegie Mellon developed a new type of soft composite material with high electrical and thermal conductivity by combining liquid elastic body and small liquid droplets of cricket alloy.They name their results as their resultsThubber.Thubber's performance is similar to liquid silicon rubber (the operating temperature range is -175 ° C to 205 ° C), which can maintain its flexibility in the range of -80 ° C to 200 ° C.The current can cause internal heating when the current is through the Thubber, which causes phase -changing reactions, so there is no need for external thermal sources.When it is difficult to use thermal oil or aluminum plate, it can be made into a super flexible thin film. 2. Wrap the carbon nanotubes with a belt polymerResearchers at Duke University recently launched a new type of carbon -based semiconductor development.This micro -cylinder composed of carbon atoms is stronger than steel, but the width is only one -fourth of the hair wire, which is of great significance for electronic manufacturing.Previously, because the micro -cylindrical body composed of carbon atoms could not be cut off, they limited their application in the electronics field, so they did not have commercial value.The research team changed its electronic characteristics from the conductor to semiconductor by wrapped a special spiral polymer around the metal nanotuba, which solved this problem. 3. Use a glass substrate for semiconductor packagingGlass is cheap, has good thermal performance, and has a physical characteristics similar to silicon.It can also maintain the shape for a long time, and can hardly deform or degenerate, which can improve the life and performance of electronic products.Compared with today's organic base, the glass base has higher signal performance, which is why the glass base is gradually popularized in advanced semiconductor packaging solutions.For emerging applications that require high -density and high -performance interconnection in the next generation of electronic products, glass substrate is an ideal choice. 4. Two -dimensional iron electric field effect crystal tubeChip manufacturers compete for emerging trends to apply artificial intelligence technology to micro -chip to challenge semiconductor engineering, because their resource -intensive characteristics have caused their energy consumption costs.The development of the two -dimensional iron electric field effect crystal pipe may help solve this problem.This technology uses the electrical characteristics of oxide and sulfide.Their gradual ability to switch iron electrical categories makes them operate 10,000 times faster than human sympathy, and at the same time, energy consumption is extremely low, which opens a new world for the development of nano -level ultra -low power consumption and high -precision artificial neurophants. 三、Are these subversive technologies have the potential for commercialization?Like all other disruptive technologies, the new methods of these semiconductor projects must have long -term business feasibility to cause people's interest, or to maintain competitiveness in front of leading companies for a long time.In most cases, these emerging technologies will have a long listing time because they are designed for the next generation of electronic products.As far as the carbon nano -nanotone wrapped in a polymer, researchers admit that their novel development methods may be far from practical applications.The situation of the glass substrate used for semiconductor packaging is the same, and problems such as stress and accumulation limit have limited its commercial feasibility.For some people in the industry, these disruptive technologies have a long market time that may be frustrated, but they are still hopeful.After all, the growing distress itself is part of the progress of the progress of semiconductor engineering.As these technologies continue to cause people's interest, the possibility of accelerating development is very high.For more electronic conponents,please refer to:https://www.ciselec.com/en/products.html 

Chinese chip production capacity may become the first in the world!

On the global chip industry's competitive track, China is moving towards a new peak at an unprecedented speed and determination.Recently, some predictions point out that byIn 2026, mainland China is expected to become the country with the largest capacity of tablet computers in the world.This news undoubtedly depicts a bright blueprint for the future development of the Chinese chip industry. The competitive situation of the global chip industryThe chip industry, this is known asThe technology of technology and grain is becoming the focus of global science and technology competition.Although the United States occupies an hegemonic position in the chip field, China's rise is gradually changing this situation.Especially after Huawei and other Chinese technology companies have encountered international market restrictions, China's independent research and development and production capacity expansion of the chip industry are particularly important. The rapid growth of Chinese chip production capacityMainland China has invested a lot of resources in the research and development and production of the silicon wafer industry, including building advanced production bases, introducing high -end talents, and strengthening cooperation with international silicon wafers.These measures have laid a solid foundation for the rapid growth of wafer capacity in mainland China. The Chinese government's strategy and supportChinese government adoptedThe Made in China 2025 plan clarifies the strategic goal of changing China's manufacturing industry from a large change to a strong.In this plan, the chip industry is listed as a key development industry. The government encourages enterprises to increase research and development investment and promote technological innovation through various methods such as financial support and tax benefits. Challenges and opportunities of the chip industry in mainland ChinaAlthough the chip industry in mainland China has a strong development momentum, there is still a gap between the world's leading level in the field of storage chips and advanced logic chips.In order to shorten this gap, China must continue to work hard in optimizing the supply chain, improvement of technical level, and cultivating talents. Future Outlook: Global Character in the Chinese Chip IndustryOn this battlefield with fierce competition in the global chip industry, mainland China is injecting fresh blood into the world's scientific and technological pattern with its rise.With the continuous progress of technology and the continuous expansion of the market, mainland China is expected to play a more important role in the global chip industry. The rise of Chinese chip production capacity is not only a manifestation of scientific and technological strength, but also a key step in the national strategic layout.We look forward to more breakthroughs in the Chinese chip industry in the future and bring more innovation and vitality to the global technology market.For more electronic conponents,please refer to:https://www.ciselec.com/en/products.html

The main characteristics and working principles of thermal resistance

What is thermal resistance?Thermal resistance is a category of sensitive components. The resistance value of thermal resistance will change with the temperature. Unlike the general fixed resistance, it is a category of variable resistors and is widely used in various electronic components. Different from pure metals in the resistance thermometer, the materials used in thermal resistors are usually ceramics or polymers. The higher the temperature coefficient thermistor, the greater the resistance value when the temperature, the lower the thermistor of the negative temperature coefficient when the temperature is, the lower the resistance value, and they belong to the semiconductor device. The thermal resistance is usually a higher accuracy within a limited temperature range, usually -90 ° C? 130 ℃. The main characteristics of thermal resistance1. High sensitivity, its resistance temperature coefficient is more than 10 to 100 times larger than the metal, which can detect temperature changes at 10-6 ° C;2. The working temperature range is wide, the normal temperature devices are applicable to -55 ℃ ～ 315 ℃, the applicable temperature of high temperature devices is higher than 315 ℃ (currently can reach 2000 ° C), and low temperature devices are suitable for -273 ° C to -55 ° C;3. Small volume, can measure the temperature of the gaps, cavity and biological blood vessels that other thermometers cannot measure;4. Easy to use, the resistance value can be selected arbitrarily between 0.1 ～ 100kΩ;5. Easy processing into complex shapes can be produced in large quantities;6. Good stability and strong overload capacity. The principle of thermal resistance working principleThermal resistance is a sensor resistor, the resistance value of thermistor, which changes with the changes in temperature, which is different from the general fixed resistance. The resistance value of the metal increases with the increase of the planting, but the semiconductor is the opposite. Its resistance value has decreased sharply with the increase of temperature, and it presents non -linear. When the temperature changes are the same, the resistance value of the thermistor resistance is about 10 times the lead thermal resistance. Therefore, it can be said that thermistor is particularly sensitive to changes in temperature. This temperature characteristics of semiconductor. It is because the conductive method of semiconductor is carrier (electronics, cave) conductive. Because the number of carriers in semiconductors is much less than free electrons in metals, its resistance is very large. As the temperature rises, the number of carrier flows participating in semiconductors will increase, so the semiconductor conductivity increases, and its resistivity will decrease. Thermistor is a thermist component made of the characteristics of the semiconductor resistance with the temperature of the semiconductor. It is made of different metal oxides according to different formulas. Within a certain temperature range, according to the changes in thermal resistance value, the temperature changes of the measured medium can be known. When installing the thermistor in the circuit, when the thermistor is the same as the ambient temperature, the action time is sharply shortened as the current increases; when the thermistor has a shorter action time and smaller when the ambient temperature is relatively high at the relatively high ambient temperature Maintain current and action current. When the circuit is working normally, the thermistor temperature is similar to the room temperature and the resistance is small, and the connecting the circuit will not hinder the passing of the current; when the circuit occurs due to the failure, the thermistor is increased due to the increase in thermal power. When the temperature exceeds the switch temperature, the resistance will increase in an instant, and the current in the circuit will quickly decrease to the safe value.For more electronic conponents,please refer to:https://www.ciselec.com/en/products.html

Classification and application of sensors

There are many classification methods of sensors. There are usually 4 methods:1. Divided into: displacement sensor, pressure sensor, speed sensor temperature sensor and gas sensitive sensor according to the input physical quantity. 2. Based on the working principle: resistance, inductance, capacitance, and potential. 3. Based on the nature of the output signal: analog sensor and digital sensor. 4. Based on the principle of energy conversion, it is divided into: active sensors and passive sensors. The source sensor converts non -electrical energy to electrical energy, such as electric momentum, charge -type sensors, etc.; The passive sensor does not afford the energy conversion effect, but the amount of non -electrical volume is rotated to the number of electrical parameters, such as resistance, inductive sensors The types of commonly used sensorsUsually, according to its basic perception function, it can be divided into ten major ten major majority of thermist components, optical components, osteitted components, Lijin components, magnetic sensitivity elements, wet sensitivity components, sound sensitivity elements, radiation sensitive components, color sensitivity components, and Weimin components. kind. 1. Heat sensorThe thermist sensor is a conversion device that converts temperature into a telecommunications signal, which can be divided into two categories: active and passive. The former's working principle is thermal release effect, thermal power effect, and semiconductor knotting effect. The working principle of the latter is the thermal characteristics of the resistance, accounting for about 55%of the thermist sensor. This sensor is more applicable in the occasion where the temperature detection accuracy is relatively high. The broader thermal resistance materials are platinum, copper, nickel, etc. They have the characteristics of large resistance temperature coefficients, good linearity, stable performance, wide use temperature range, and easy processing. It is used to measure temperature within the range of -200 ℃ ～+500 ℃. 2. Optical sensorThe light sensor is one of the most common sensors. There are many types, mainly: optical pipes, photoelectric multiplication pipes, photoresist resistance, solar cells, solar batteries, infrared sensors, ultraviolet sensors, fiber optoelectronics sensors, color sensors, CCDs and CCD and CMOS image sensor, etc. Major domestic manufacturers include the OTRON brand. The light sensor is one of the most output and the most widely used sensor. It occupies a very important position in automatic control and non -electrical electricity testing technology. The easiest light sensor is the light resistance, and the current will generate current when the photon shock junction is generated. 3. Qi -sensitive sensorQi -sensitive sensor is a sensor used to detect gas concentration and ingredients, which plays a very important role in environmental protection and safety supervision. The gas -sensitive sensor is exposed to the gas of various ingredients. Because the temperature and humidity of the detection site have changed a lot, there are a lot of dust and oil mist, so their working conditions are harsh, and the material of the gas to the sensing element is material. Chemical reactions are generated, attached to the surface of the component, often making their performance worse. Therefore, there is the following requirements for the gas -sensitive sensor: it can detect the allowable concentration of the alarm gas and the gas concentration of other standard values. It can work stable for a long time, good repetitiveness, fast response speed, and small effects caused by coexisting substances. 4. Limin sensorLimin sensor is a conversion device that converts mechanics such as stress and pressure into a electrical signal. The Limin sensor has various forms such as resistance, capacitance, inductance, voltage and current, and they each have advantages and disadvantages. It is widely used in various industrial self -control environments, involving water conservancy and hydropower, railway transportation, smart buildings, production self -control, aerospace, military, petrochemical, oil wells, electric power, ships, machine tools, pipelines and other industries. 5. Magnetic sensorHall sensors are a magnetic field sensor based on Hall effect, which is widely used in industrial automation technology, detection technology and information processing. Hall effect is the basic method of studying the performance of semiconductor materials. The Hall coefficient measured by Hall effect experiment can judge important parameters such as conductive type, load concentration, and load migration rate of semiconductor materials. The Hall effect sensor is a passive sensor. It must have external power supply to work. This feature allows it to detect the operation of low speed. 6. Wet sensitivity sensorThe wet sensor sensor can feel the external humidity changes and change the humidity into a device with the physical or chemical properties of the device material into a device with a useful signal. The characteristic requirements of the ideal wet sensitivity sensor are suitable for use within the wide temperature and wet range, and the measurement accuracy should be high; long service life and good stability; fast response speed, small wet stagnation difference, good reproducibility; sensitivity High, good linear, small temperature coefficients; simple manufacturing process, easy to produce in batches, simple conversion circuits, low cost; corrosion resistance, low temperature and high temperature characteristics, etc. 7. Sound sensorSound sensor is a sensor used for flow detection. The sensor can be set with power when wiring, and operates in a range mode of high/low sensitivity. The high -sensitivity volume is suitable for high -frequency signals that fluctuate at 40dB. The low -sensitivity range is applied to high -frequency signals from 28DB to 68DB. The sensor can operate alone by providing external power supply to control the device. Sound sensor is mainly used for solid flow detection. At the same time, the device can also be used for the detection of water pump air erosion and liquid leakage, and then generates sufficient sound alarm. 8. Radiation sensorAfter the material is radiated, it is irradiated. Some characteristics (such as refractive index) change. Collective referred to as radiation effects. For example, after some special ingredients (fiber -doped fiber) made of special ingredients, the refractive index changes. The receiving light intensity changes, so it can be made into a fiber radiation sensor. The role of radiation and material is the basis of all nuclear radiation sensors. 9. Visual sensorThe visual sensor has a pixel that captures the light from a whole image. The clearness and delicateness of the image are usually measured by resolution, which is represented by the number of pixels. The low cost and ease of visual sensor have attracted machine designers and craft engineers to integrate them into various types of applications that have relying on artificial, multiple photoelectric sensors, or unbridled applications at all. The industrial applications of visual sensors include inspection, measurement, measurement, directional, defect detection and separation. 10. Weimin sensor (electronic tongue)The electronic tongue is an analog tongue to analyze, identify and judge the sample measurement of samples, and use multiple statistical methods to process the obtained data, quickly reflect the overall quality information of the sample, and realize the identification and classification of samples. It is a detection technology based on the overall characteristics of the sample as the overall characteristic response signal that uses the multi -sensing arrays as the foundation to perceive the overall characteristics of the sample. It is mainly composed of three parts: the taste sensor array, the signal acquisition system and the mode recognition system.For more electronic conponents,please refer to:https://www.ciselec.com/en/products.html

Film 3D integrated circuit key technology